Influence of the Molecular Adhesion Force on the Indentation Depth of a Particle into the Wafer Surface in the CMP Process

Table 1

Hamaker constant of Cu-Water-Al₂O₃.

Materials	Water	Vacuum	Unit	Reference
Copper	30	40	10^−20 J	[6]
Water	—	4.0	10^−20 J	[6]
Al2O3	4.44	16.75	10^−20 J	[6]
Polyurethane-water-silicon nitride	0.1–1		10^−20 J	[6]