Improvement of Homogeneity and Aspect Ratio of Silicon Tips for Field Emission by Reactive-Ion Etching
Figure 2
Schematic of the structured cathode fabrication process (simulated with IntelliSuite). (a) Thermal growth of SiO2 layer. (b) Photolithography with AZ5214. (c) Transferring of the structures into SiO2 by reactive-ion etching. (d) Reactive-ion etching of the bulk Si. (e) Sharpening of the tips by wet thermal oxidation. (f) Wet chemical removal of SiO2.
