The Microstructure and Thermal Conductivity of Pressureless Infiltrated <svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-6.9968pt" id="M1" height="19.2574pt" version="1.1" viewBox="-0.0657574 -12.2606 54.7667 19.2574" width="54.7667pt"><g transform="matrix(.017,0,0,-0.017,0,0)"><path id="g121-81" d="M409 504C401 567 396 607 392 642C354 654 312 665 266 665C137 665 60 583 60 487C60 374 161 325 225 290C300 250 355 215 355 141C355 68 311 21 235 21C131 21 86 122 71 183L41 176C48 128 61 42 68 21C78 16 93 8 118 0C142 -7 175 -15 216 -15C349 -15 438 69 438 174C438 287 344 333 265 374C186 414 138 449 138 522C138 576 172 631 249 631C336 631 363 562 380 499L409 504Z"/></g><g transform="matrix(.017,0,0,-0.017,8.031,0)"><path id="g121-103" d="M135 536C164 536 186 560 186 587C186 617 164 639 136 639C109 639 85 617 85 587C85 560 109 536 135 536ZM252 0V26C188 32 181 38 181 106V451C138 433 90 420 39 412V388C99 379 102 374 102 312V106C102 38 95 32 32 26V0H252Z"/></g><g transform="matrix(.017,0,0,-0.017,12.63,0)"><path id="g121-65" d="M614 175C564 76 510 21 408 21C256 21 146 149 146 336C146 488 235 629 402 629C510 629 570 586 597 480L626 488C620 541 614 582 606 638C578 643 510 665 429 665C206 665 44 527 44 316C44 157 153 -15 402 -15C474 -15 558 5 586 11C604 45 629 119 643 165L614 175Z"/></g><g transform="matrix(.012,0,0,-0.012,24.131,4.134)"><path id="g58-110" d="M173 382V461C125 442 68 425 25 418V390C88 382 92 382 92 317V-127C92 -191 84 -199 18 -204V-235H259V-204C180 -196 173 -192 173 -120V7C188 -1 212 -11 243 -12C375 12 495 109 495 261C495 361 427 451 316 451C303 451 283 446 266 435L173 382ZM173 345C200 365 243 388 274 388C346 388 409 329 409 222C409 111 353 40 266 40C231 40 196 56 173 79V345Z"/></g><g transform="matrix(.017,0,0,-0.017,31.227,0)"><path id="g113-48" d="M368 703H309L44 -163H104L368 703Z"/></g><g transform="matrix(.017,0,0,-0.017,38.304,0)"><path id="g121-63" d="M673 0V28C608 34 594 43 563 129C499 303 432 494 370 665L339 656L132 132C98 43 84 37 20 28V0H238V28C162 35 154 45 175 108C188 150 203 192 219 237H432C454 176 474 122 487 83S491 36 428 28V0H673ZM418 280H234C265 362 296 450 328 535H330L418 280Z"/></g><g transform="matrix(.017,0,0,-0.017,50.213,0)"><path id="g121-106" d="M238 0V26C174 32 166 38 166 104V712C132 700 70 683 18 677V653C81 647 87 645 87 577V104C87 38 78 32 15 26V0H238Z"/></g></svg> Composites Containing Electroless Nickel Platings

<div>Micrographs of coated SiC particles after thermal shock.</div>

Advances in Materials Science and Engineering

fig6

Figure 6

Figure 6: The Microstructure and Thermal Conductivity of Pressureless Infiltrated <svg xmlns:xlink="http://www.w3.org/1999/xlink" xmlns="http://www.w3.org/2000/svg" style="vertical-align:-6.9968pt" id="M1" height="19.2574pt" version="1.1" viewBox="-0.0657574 -12.2606 54.7667 19.2574" width="54.7667pt"><g transform="matrix(.017,0,0,-0.017,0,0)"><path id="g121-81" d="M409 504C401 567 396 607 392 642C354 654 312 665 266 665C137 665 60 583 60 487C60 374 161 325 225 290C300 250 355 215 355 141C355 68 311 21 235 21C131 21 86 122 71 183L41 176C48 128 61 42 68 21C78 16 93 8 118 0C142 -7 175 -15 216 -15C349 -15 438 69 438 174C438 287 344 333 265 374C186 414 138 449 138 522C138 576 172 631 249 631C336 631 363 562 380 499L409 504Z"/></g><g transform="matrix(.017,0,0,-0.017,8.031,0)"><path id="g121-103" d="M135 536C164 536 186 560 186 587C186 617 164 639 136 639C109 639 85 617 85 587C85 560 109 536 135 536ZM252 0V26C188 32 181 38 181 106V451C138 433 90 420 39 412V388C99 379 102 374 102 312V106C102 38 95 32 32 26V0H252Z"/></g><g transform="matrix(.017,0,0,-0.017,12.63,0)"><path id="g121-65" d="M614 175C564 76 510 21 408 21C256 21 146 149 146 336C146 488 235 629 402 629C510 629 570 586 597 480L626 488C620 541 614 582 606 638C578 643 510 665 429 665C206 665 44 527 44 316C44 157 153 -15 402 -15C474 -15 558 5 586 11C604 45 629 119 643 165L614 175Z"/></g><g transform="matrix(.012,0,0,-0.012,24.131,4.134)"><path id="g58-110" d="M173 382V461C125 442 68 425 25 418V390C88 382 92 382 92 317V-127C92 -191 84 -199 18 -204V-235H259V-204C180 -196 173 -192 173 -120V7C188 -1 212 -11 243 -12C375 12 495 109 495 261C495 361 427 451 316 451C303 451 283 446 266 435L173 382ZM173 345C200 365 243 388 274 388C346 388 409 329 409 222C409 111 353 40 266 40C231 40 196 56 173 79V345Z"/></g><g transform="matrix(.017,0,0,-0.017,31.227,0)"><path id="g113-48" d="M368 703H309L44 -163H104L368 703Z"/></g><g transform="matrix(.017,0,0,-0.017,38.304,0)"><path id="g121-63" d="M673 0V28C608 34 594 43 563 129C499 303 432 494 370 665L339 656L132 132C98 43 84 37 20 28V0H238V28C162 35 154 45 175 108C188 150 203 192 219 237H432C454 176 474 122 487 83S491 36 428 28V0H673ZM418 280H234C265 362 296 450 328 535H330L418 280Z"/></g><g transform="matrix(.017,0,0,-0.017,50.213,0)"><path id="g121-106" d="M238 0V26C174 32 166 38 166 104V712C132 700 70 683 18 677V653C81 647 87 645 87 577V104C87 38 78 32 15 26V0H238Z"/></g></svg> Composites Containing Electroless Nickel Platings 

Advances in Materials Science and Engineering

The Microstructure and Thermal Conductivity of Pressureless Infiltrated Composites Containing Electroless Nickel Platings

Figure 6