Characterization on Contacting Surfaces of MEMS Electrostatic Switches by SEM, EDXA, and XPS

Figure 3

SEM image (×1100) and EDX analysis of the movable cover of DS switch and its reverse side. The elemental composition (wt.%) in point (1) on the contacting surface (marked in Figure 1(b) by #4) is Au 82.8, O 7.4, Al 3.8, Cu 3.2, and Rh 2.8, and in the outside-Au 88.7, O 7.0, and Al 4.3.