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Advances in Smart Materials and Applications

Call for Papers

Evolution of engineering materials is strongly depending on the growing transformation of complexity in engineering products. New materials being designed are required to provide specific properties and demonstrate certain functional characteristics by manipulating their dimension, chemistry, and structure through various advanced technologies. Therefore, “smartness” of a material has become the topic of interest. Properties of smart materials may change according to the applied external stimuli. For example, colors of electrochromic and thermochromic materials may change when an appropriate amount of electric and thermal energy is applied to the materials, respectively. In this special issue, the main focus is on the advances of organic- and inorganic-based smart materials and their applications in areas of energy, environment, security, and health. Potential topics include, but are not limited to:

  • Thermochromic and electrochromic materials
  • Adaptive oxide electronic materials
  • Shape memory materials
  • Piezoelectric materials
  • Piezophotonic materials
  • Piezophototronic materials
  • Thermo- and photoelectric materials
  • Smart materials for energy harvesting
  • Smart materials for multifunctional sensors
  • Smart materials for actuators
  • Simulation and modeling of smart materials

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/amse/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/amse/asma/ according to the following timetable:

Manuscript DueFriday, 3 January 2014
First Round of ReviewsFriday, 28 March 2014
Publication DateFriday, 23 May 2014

Lead Guest Editor

  • Kuan Yew Cheong, School of Materials & Mineral Resources Engineering, Universiti Sains Malaysia, Malaysia

Guest Editors

  • Kean Aw, Department of Mechanical Engineering, University of Auckland, Auckland, New Zealand
  • Khasan S. Karimov, Faculty of Electronic Engineering, Ghulam Ishaq Khan Institute of Engineering Sciences and Technology (GIK), Swabi, Pakistan
  • Feng Zhao, Department of Electrical Engineering, Washington State University, Pullman, WA, USA
  • Mohammad Mahroof-Tahir, Department of Chemistry and Earth Sciences, Qatar University, Doha, Qatar
  • Rupert Schreiner, Faculty of General Studies & Microsystems, Regensburg University of Applied Sciences, Regensburg, Germany