New Materials, Structures, and Concepts for Optical Fiber Sensing Applications
Call for Papers
Optical fiber sensor has been a rapidly expanding field in the past few decades. Many sensor devices and systems have been successfully developed for a great variety of measurements and applications, while new materials, structures, and concepts are continuously emerging in the field.
We invite authors to contribute original research articles as well as review articles that will stimulate the continuing efforts in exploiting new materials, structures, and concepts for optical fiber sensing applications. The aim of this special issue is to provide an open forum for international experts to report their recent research progress, summarize their outcomes, and reveal the development trends in the field. Potential topics include, but are not limited to:
- Fiber interferometers
- Fiber gratings
- New fiber devices and structures
- High-temperature sensors
- Chemical/biochemical and environmental sensors
- Microstructured fibers
- Polymer fibers
- Micro-/nanofibers
- Specialty fibers
- New material-based fiber sensors
- New concept sensors
- New sensor applications
- Sensing techniques in industrial situations
- Surface Raman scattering
Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/aot/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/ according to the following timetable:
| Manuscript Due | Friday, 13 April 2012 |
| First Round of Reviews | Friday, 13 July 2012 |
| Publication Date | Friday, 12 October 2012 |
Lead Guest Editor
- D. N. Wang, Department of Electrical Engineering, The Hong Kong Polytechnic University, Hung Hom, Kowloon, Hong Kong
Guest Editors
- Gang-Ding Peng, School of Electrical Engineering and Telecommunications, The University of New South Wales, Sydney, NSW 2052, Australia
- Min Zhang, Department of Electronic Engineering, Tsinghua University, Beijing, China