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International Journal of Power Management Electronics
Volume 2008 (2008), Article ID 678415, 9 pages
http://dx.doi.org/10.1155/2008/678415
Research Article

On-Chip Bondwire Magnetics with Ferrite-Epoxy Glob Coating for Power Systems on Chip

School of Electrical Engineering and Computer Science, University of Central Florida, Orlando, FL 32816, USA

Received 3 January 2008; Accepted 13 May 2008

Academic Editor: Ty McNutt

Copyright © 2008 Jian Lu et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

A novel concept of on-chip bondwire inductors and transformers with ferrite epoxy glob coating is proposed to offer a cost effective approach realizing power systems on chip (SOC). We have investigated the concept both experimentally and with finite element modeling. A Q factor of 30–40 is experimentally demonstrated for the bondwire inductors which represents an improvement by a factor of 3–30 over the state-of-the-art MEMS micromachined inductors. Transformer parameters including self- and mutual inductance and coupling factors are extracted from both modeled and measured S-parameters. More importantly, the bondwire magnetic components can be easily integrated into SOC manufacturing processes with minimal changes and open enormous possibilities for realizing cost-effective, high-current, high-efficiency power SOCs.