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ElectroComponent Science and Technology
Volume 2 (1975), Issue 1, Pages 45-53
http://dx.doi.org/10.1155/APEC.2.45

Field Assisted Glass Sealing

P. R. Mallory & Co. Inc., Laboratory for Physical Science, Burlington 01803, Ma, USA

Received 20 March 1974

Copyright © 1975 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The paper reviews the experimental, theoretical and applications work by several authors on a glass sealing technique which was announced five years ago. In the process, an electrostatic field is utilized to promote bonding at relatively low temperatures. The process variables and seal properties are described in detail. A discussion is presented of the mechanisms which are believed to play a role in bond formation. As an example of the utility of the technique, its highly successful application to the mounting of strain gauges is described.