About this Journal Submit a Manuscript Table of Contents
ElectroComponent Science and Technology
Volume 4 (1977), Issue 3-4, Pages 143-146
http://dx.doi.org/10.1155/APEC.4.143

Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits

AEG-Telefunken Nachrichten- und Verkehrstechnik AG, Geschäftsbereich Hochfrequenztechnik Elisabethenstr, Donau, Ulm 3 D 7900, Germany

Received 1 June 1977

Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Holger Meinel, Bernhard Rembold, and Werner Wiesbeck, “Optimisation of Thin and Thick Film Technology for Hybrid Microwave Circuits,” ElectroComponent Science and Technology, vol. 4, no. 3-4, pp. 143-146, 1977. doi:10.1155/APEC.4.143