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ElectroComponent Science and Technology
Volume 4 (1977), Issue 3-4, Pages 157-161
http://dx.doi.org/10.1155/APEC.4.157

Remarks on Wire and Die Bonding for Hybrid Circuits

Kulicke and Soffa Industries, lnc., Horsham 19044, Pennsylvania, USA

Received 8 June 1977

Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Advances in hybrid automatic wire bonding include refined joy stick techniques, automatic alignment, a digitally operated head for higher speeds and flexibility, missing ball detection and programming aids. Advanced hybrid die attach equipment will have to accept a large variety of chip presentation techniques but will use CCTV and automatic alignment with microprocessor controls to aid programming and speed output.