Improved Hybrid Circuit Assembly Yields and Reliability by
Glassivation of the Semiconductor Chip

doi:10.1155/APEC.4.117

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ElectroComponent Science and Technology
Volume 4 (1977), Issue 3-4, Pages 117-124
doi:10.1155/APEC.4.117

Improved Hybrid Circuit Assembly Yields and Reliability by Glassivation of the Semiconductor Chip

B. C. Heap and S. A. France

Ferranti Limited, Chadderton, UK

Received 5 March 1977

Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Lead glass passivation (glassivation) of semiconductor chips has been investigated. Glassivation of BC107 type transistor chips has resulted in improved robustness and their ability to withstand ionic contamination better than control chips. Increased yields were observed when glassivated transistor chips were assembled in ceramic flat packages.