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ElectroComponent Science and Technology
Volume 4 (1977), Issue 2, Pages 53-56
doi:10.1155/APEC.4.53
Hybrid Interconnection of I.C.'S by Means of Patterns on Flexible Tape
N. V. Philips' Gloeilampenfabrieken, Eindhoven, The Netherlands
Received 20 March 1977
Copyright © 1977 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
Abstract
Mounting of I.C.'s on thickfilm circuits by means of patterns on foil of a total thickness of about 30 microns is described. The extreme flexibility of the foil and some well controlled characteristics of the thickfilm process aid soldering of the chip with a reproducible low heat resistance to the substrate in a cheap and reliable way.