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ElectroComponent Science and Technology
Volume 5 (1978), Issue 1, Pages 49-53
http://dx.doi.org/10.1155/APEC.5.49

Hybrid Realisation of High Precision Analog Conversion Modules

Industrial Research Institute for Electronics, HIKI, Budapest, Hungary

Received 1 October 1977

Copyright © 1978 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

High precision analog modules are manufactured using film technologies. Components which are critical as regards operation and stability are made by thin film technology, additional elements and interconnection of active components are made using thick film technology.

Using these two separate manufacturing methods to obtain high stability and accuracy, optimum cost and yield can be achieved. To illustrate these facts, two circuits are discussed in detail, a voltage to frequency converter and a log amplifier.