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ElectroComponent Science and Technology
Volume 5 (1978), Issue 1, Pages 3-7
http://dx.doi.org/10.1155/APEC.5.3

Hybrids in Telecommunications

Telettra S.p.A., Vimercate (MI), 20059, Italy

Copyright © 1978 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The telecommunication industry has greatly contributed to the diffusion of hybrid technology in all electronic fields. The approach, followed by almost every telecommunication company, in order to optimize the implementation of hybrid circuits, is to use both thin and thick film technologies. After a short review of the characteristics of the telecommunication market, which affect hybrid technology, the adaptive and simple but powerful approach of Telettra will be presented.