Properties of Nickel Films Prepared by R.F. Sputtering and Interdiffusion Analysis of Ta₂N–Ni Films

Abstract

Ni film deposition by r.f. sputtering and etching conditions have been investigated. The contact resistance and adhesion of this Ni layer deposited directly onto Ta₂N films have also been studied in air and at elevated temperatures. In this combination, the Ta₂N/Ni interdiffusion analysis was carried out by the Secondary Ion Mass Spectroscopy (SIMS).