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ElectroComponent Science and Technology
Volume 7 (1980), Issue 1-3, Pages 159-162
http://dx.doi.org/10.1155/APEC.7.159

Properties of Nickel Films Prepared by R.F. Sputtering and Interdiffusion Analysis of Ta2N–Ni Films

1THOMSON–CSF – Domaine de Corbeville, Orsay 91400, France
2University of Alexandra, Egypt

Received 13 March 1980

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

Ni film deposition by r.f. sputtering and etching conditions have been investigated. The contact resistance and adhesion of this Ni layer deposited directly onto Ta2N films have also been studied in air and at elevated temperatures. In this combination, the Ta2N/Ni interdiffusion analysis was carried out by the Secondary Ion Mass Spectroscopy (SIMS).