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ElectroComponent Science and Technology
Volume 7 (1980), Issue 1-3, Pages 55-62
http://dx.doi.org/10.1155/APEC.7.55

Comparison of Enameled Steel Substrate Properties for Thick Film Use

Electro-Science Laboratories, Inc., Pennsauken, N.J., USA

Received 11 June 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

S. J. Stein, C. Huang, and A. S. Gelb, “Comparison of Enameled Steel Substrate Properties for Thick Film Use,” ElectroComponent Science and Technology, vol. 7, no. 1-3, pp. 55-62, 1980. doi:10.1155/APEC.7.55