Abstract
Developments in encapsulants, in particular in relation to stress and humidity protection, are examined. Superior protection can now be achieved with flexible room temperature curing silicone encapsulants.
Open Access
Silicone Resin and Elastomer Protection of Hybrid Circuits
Received04 Apr 1979
Copyright
Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the
Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.