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ElectroComponent Science and Technology
Volume 6 (1980), Issue 3-4, Pages 159-163
http://dx.doi.org/10.1155/APEC.6.159

An Installed Tape Automated Bonding Unit

Cii-Honeywell Bull, 20 rue Dieumegard, Saint-Ouen 93406, France

Received 27 April 1979

Copyright © 1980 Hindawi Publishing Corporation. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

Abstract

The Tape Automated Bonding (TAB) was developed and industrialized to achieve a higher packaging density in computer applications. After elaboration and testing of the prototype units, significant work was done to transfer all the activity into production.

After a brief review of the principle of TAB technology the main characteristics of the manufacturing site are presented and the most significant equipments developed for production needs are briefly described. It becomes apparent that TAB and micropackaging technology are not limited to computers but can be considered in many other microelectronic applications.