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Active and Passive Electronic Components
Volume 2012 (2012), Article ID 763572, 10 pages
http://dx.doi.org/10.1155/2012/763572
Research Article

Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC

1Department of Electrical Engineering, National Taiwan University, Taipei 10617, Taiwan
2Department of Electrical Engineering, Tamkang University, New Taipei City 25137, Taiwan
3Department of Electrical and Computer Engineering, Duke University, Durham, NC 27708, USA

Received 27 April 2012; Revised 7 October 2012; Accepted 18 October 2012

Academic Editor: Gerard Ghibaudo

Copyright © 2012 Chi-Jih Shih et al. This is an open access article distributed under the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.

How to Cite this Article

Chi-Jih Shih, Chih-Yao Hsu, Chun-Yi Kuo, James Li, Jiann-Chyi Rau, and Krishnendu Chakrabarty, “Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC,” Active and Passive Electronic Components, vol. 2012, Article ID 763572, 10 pages, 2012. doi:10.1155/2012/763572