Research Article
Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC
Table 2
The second test case.
| Die | Circuit | Die area (mm2) | Die power (W) |
| Die 4 | p93791 | 7.30 × 4.21 | 42.97 | Die 3 | p22810 | 3.37 × 2.92 | 13.79 | Die 2 | p34392 | 2.54 × 2.86 | 10.16 | Die 1 | f2126 | 3.29 × 1.32 | 6.09 | Die 0 | d695 | 1.33 × 1.97 | 3.63 |
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