Thermal-Aware Test Schedule and TAM Co-Optimization for Three-Dimensional IC

Table 3

The third test case.

Die	Circuit	Die area (mm^2)	Die power (W)
Die 4	t512505	4.92 × 4.95	34.08
Die 3	a586710	3.72 × 3.69	17.22
Die 2	q12710	2.99 × 2.79	11.65
Die 1	h953	1.09 × 1.61	2.46
Die 0	g1023	1.23 × 1.32	2.28