Research Article

Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Figure 6

Crosstalk delays for different CNT bundles at (a) 50 μm, (b) 100 μm, (c) 150 μm, and (d) 200 μm TSV heights, where SWB, DWB, MWB(4), MWB(8), and MWB(10) represent the bundled SWCNT, DWCNT, and 4-shell, 8-shell, and 10-shell MWCNTs, respectively.
524107.fig.006a
(a)
524107.fig.006b
(b)
524107.fig.006c
(c)
524107.fig.006d
(d)