Signal Integrity Analysis in Carbon Nanotube Based Through-Silicon Via

Table 3

Percentage reduction of out-phase delay for 10-shell MWCNT bundled TSV w.r.t. SWCNT, DWCNT, and 4-shell and 8-shell MWCNT bundle based TSVs.

TSV heights (𝜇m)	% reduction in delay for MWCNT bundle (shell = 10) in comparison to
	SWB	DWB	MWB (shell = 4)	MWB (shell = 8)
50	78.14	60.86	35.98	10.19
100	85.27	70.12	44.12	10.55
150	88.61	75.69	49.89	13.49
200	90.37	78.84	53.67	15.99