Research Article
On the Evaluation of Gate Dielectrics for 4H-SiC Based Power MOSFETs
Table 1
List of physical properties of various dielectric materials reported in the literature.
| Material | Dielectric constant () | Bandgap (eV) | (eV) with respect to Si | (eV) with respect to 4H-SiC | Structure | Preparation method |
| SiO2 | 3.9 | 8.9 | 3.2 | 2.2–2.7 | Amorphous | Thermal, PECVD | Si3N4 | 7.0 | 5.1 | 2.0 | — | Amorphous | Thermal, LPCVD, MOCVD | SiON | 4.0–7.0 | 5.0–9.0 (O/N ratio) | 2.8 | — | Amorphous | Thermal, PECVD | Al2O3 | 9.0 | 8.7 | 2.8 | 1.7 | Amorphous | Sputtering, ALCVD | HfO2 | 25 | 5.7 | 1.5–1.7 | 0.54 and 0.7–1.6 |
Mono, tetra, cubic | Sputtering, ALCVD | ZrO2 | 25 | 7.8 | 1.4 | 1.6 | Mono, tetra, cubic | ALCVD | Ta2O5 | 26 | 4.5 | 1–1.5 | — | Orthorhombic | MOCVD | Y2O3 | 15.0 | 5.6 | 2.3 | — | Cubic | — | La2O3 | 30 | 4.3 | 2.3 | — | Cubic | — | AlN | 9.14 | 6.2 | 2.2 | 1.7 | Wurtzite | MOCVD |
|
|