The Second European Hybrid Microelectronics Conference. Part I

• Editorial, D. S. Campbell
  Volume 6 (1980), Issue 3-4, Pages 125-125
• Silicone Resin and Elastomer Protection of Hybrid Circuits, Brian R. Trego
  Volume 6 (1980), Issue 3-4, Pages 127-130
• State of the Art in Thin Film Transistor: A Review of the Used Insulator–Semiconductor Combinations, André van Calster and Alexis de Vos
  Volume 6 (1980), Issue 3-4, Pages 131-134
• Thick Film Thermal Print Heads, Peter Barnwell
  Volume 6 (1980), Issue 3-4, Pages 135-139
• Electrical Transport in Thick Film Resistors, Robert M. Hill
  Volume 6 (1980), Issue 3-4, Pages 141-145
• Gold-Aluminium Intermetallic Compound Formation, E. Galli, G. Majni, C. Nobili, and G. Ottaviani
  Volume 6 (1980), Issue 3-4, Pages 147-150
• A User Made Thick Film System, M. Honore, R. Govaearts, D. Hostens, B. Bouw, B. Matton, and V. Jansoone
  Volume 6 (1980), Issue 3-4, Pages 151-158
• An Installed Tape Automated Bonding Unit, Karel Kurzweil
  Volume 6 (1980), Issue 3-4, Pages 159-163
• Effects of Refiring Processes on Electrical and Structural Properties of Thick-Film Resistors, A. Cattaneo and M. Prudenziati
  Volume 6 (1980), Issue 3-4, Pages 165-171
• Hybrid Electronic Watt-Hour Meter, J. Trontelj, L. Trontelj, F. Jan, and M. Hrovat
  Volume 6 (1980), Issue 3-4, Pages 173-175
• A Technique for the Measurement of Hot Spots and Isotherm Profiles at the Surfaces of the Elements of Hybrid Microcircuits, F. N. Sinnadurai
  Volume 6 (1980), Issue 3-4, Pages 177-183
• An Alternative Way of Making Bumps for Tape Automated Bonding, Karel Kopejtko and Jindřich Vilím
  Volume 6 (1980), Issue 3-4, Pages 185-187
• 1 GHz Low-Noise Hybrid Preamplifier for Optical Detection, O. Monti, A. Scavennec, and P. le Men
  Volume 6 (1980), Issue 3-4, Pages 189-191
• New Thick Film Sensors, S. Leppävuori
  Volume 6 (1980), Issue 3-4, Pages 193-197
• State of the Art in Design and Technology of SAW Devices, P. E. Lagasse
  Volume 6 (1980), Issue 3-4, Pages 199-204
• Economics and the Market, E. Effenberger
  Volume 6 (1980), Issue 3-4, Pages 205-207
• Materials and Applications for Thin Films in Hybrid Microelectronics, G. Zinsmeister
  Volume 6 (1980), Issue 3-4, Pages 209-214
• Advances in Thick Film Conductors for Microwave Integrated Circuits, R. Wayne Johnson, Phil W. Rich, Debbie D. Rich, and Larry K. Wilson
  Volume 6 (1980), Issue 3-4, Pages 215-218
• Thin Film Al-Al₂O₃-Al Capacitors With Dielectric Layer Formed at 400℃, S. J. Osadnik and T. Berlicki
  Volume 6 (1980), Issue 3-4, Pages 219-222
• New Light-Sensitive Positive-Working Thick Resist Materials for Various Electronic Applications, H. Ruckert
  Volume 6 (1980), Issue 3-4, Pages 223-225
• A Computer Programme With Temperature Gradient Capability for the Network Analysis of Hybrid Circuits, Carl R. Zimmer
  Volume 6 (1980), Issue 3-4, Pages 227-229
• Thin-Film Resistors for Hybrid Integrated Circuits, Z. Kempisty, L. Kròl-Stępniewska, and W. Posadowski
  Volume 6 (1980), Issue 3-4, Pages 231-233
• Tantalum Thin Film Capacitors With Various Types of Counterelectrodes, G. P. Ferraris and R. May
  Volume 6 (1980), Issue 3-4, Pages 235-240
• Some Observations on the Accelerated Ageing of Thick-Film Resistors, F. N. Sinnadurai, P. E. Spencer, and K. J. Wilson
  Volume 6 (1980), Issue 3-4, Pages 241-246
• Influence of the Substrate on the Electrical Properties of Thick-Film Resistors, A. Cattaneo, L. Pirozzi, B. Morten, and M. Prudenziati
  Volume 6 (1980), Issue 3-4, Pages 247-251
• An Improved Thick Film Aluminium Conductor Process, R. E. Cooper, P. F. T. Linford, and J. Savage
  Volume 6 (1980), Issue 3-4, Pages 253-261
• Helium Leak Measurements as a Predictor of Hermetic Package Life in Surgically-implanted Microelectronic Devices, P. E. K. Donaldson
  Volume 6 (1980), Issue 3-4, Pages 263-263
• Book Reviews
  Volume 6 (1980), Issue 3-4, Pages 265-266
• Conference Diary
  Volume 6 (1980), Issue 3-4, Pages 267-269
• Announcement
  Volume 6 (1980), Issue 3-4, Pages 270-270