This paper describes the state of the art in the development of a polymer based printed circuit board (PCB)
compatible resistor ink system. The subject is treated from the standpoint of the manufacturer who, up to now,
supplied himself with PCB circuitry.

M.  Honore

R.  Govaearts

D.  Hostens

B.  Bouw

B.  Matton

V.  Jansoone

A User Made Thick Film System

A 1 GHz low- noise preamplifier, especially designed for photodetection purposes is described. The amplifier noise
which sets a limit to the sensitivity of the photodiode-preamplifier combination is minimized using a hybrid technology
which allows very low values of the parasitics. Results on a complete photodiode-equalized preamplifier are
given.

O.  Monti

A.  Scavennec

P.  le Men

1 GHz Low-Noise Hybrid Preamplifier for Optical Detection

In this paper the different classes of surface acoustic wave devices are briefly reviewed and examples of the state of
the art are given. The fabrication techniques and the application of SAW components are also discussed.

P. E. Lagasse

State of the Art in Design and Technology of SAW Devices

P. E. K. Donaldson

Helium Leak Measurements as a Predictor of
Hermetic Package Life in Surgically-implanted Microelectronic
Devices

Methods of accelerating the ageing of thick-film resistors (TFRs) have been explored, with encouraging results from
experiments in which elevated temperature and damp heat were inflicted on TFRs. Consistent acceleration was
obtained by increasing temperature, whether by storage or dissipation, the activation energies for thermal ageing of
various resistor families lying in the range 0.5 eV&#8211;1.5 eV. Acceleration by humidity (RH) was also obtained,
corresponding, for example, to a halving of life for a 20&#37; increase of RH, some resistance changes being about an
order of magnitude larger than those obtained at elevated temperature. The encapsulations played a dominant role
in the degradation of resistors under both stress conditions.According to the theories of conduction, degradation could occur because of reactions at conductive sites,
causing corresponding changes in the conductivity and resistance versus temperature (R(T)) characteristics.
Progressive degradation certainly did occur, as evidenced by the conformity of the ageing behaviour to a diffusion-type
(time)1/2 dependence accompanied by shifts in the R(T) characteristics. Some interpretation of the
degradation has been possible by referring to an empirical model of the temperature dependence of resistance, but
conflicting changes can be reconciled with the model only by postulating competing degradation mechanisms. The
report covers an early stage of the work.

F. N. Sinnadurai

P. E. Spencer

K. J. Wilson

Some Observations on the Accelerated Ageing of Thick-Film Resistors

The Tape Automated Bonding (TAB) was developed and industrialized to achieve a higher packaging density in
computer applications. After elaboration and testing of the prototype units, significant work was done to transfer
all the activity into production.After a brief review of the principle of TAB technology the main characteristics of the manufacturing site are
presented and the most significant equipments developed for production needs are briefly described. It becomes
apparent that TAB and micropackaging technology are not limited to computers but can be considered in many
other microelectronic applications.

Karel  Kurzweil

An Installed Tape Automated Bonding Unit

D. S. Campbell

Editorial

This paper deals with the technology of the thin film transistor (TFT). It deals with the different semiconductors
used successfully in a TFT, as well as the different gate insulators employed. A variety of structures have been
realized in the past. The most important difficulty with the use of these TFT structures consisted of low frequency
instabilities, caused by mobile ions in the insulator and slow states at the semiconductor-insulator interface. Various
proposed solutions to these problems will be discussed.

Andr&#233;  van Calster

Alexis  de Vos

State of the Art in Thin Film Transistor: A Review of the Used
Insulator&#8211;Semiconductor Combinations

Developments in encapsulants, in particular in relation to stress and humidity protection, are examined. Superior
protection can now be achieved with flexible room temperature curing silicone encapsulants.

Brian R. Trego

Silicone Resin and Elastomer Protection of Hybrid Circuits

A simple technique for measuring surface temperatures with high sensitivity and spatial resolution, which is
particularly useful for examining temperature distributions of microcircuits, is described. The invention exploits
the well-defined &#8220;Isotropic-point&#8221; transitions of nematic liquid crystals from optical birefringence to anisotropy,
using a polarising microscope to detect temperatures in microscopic areas. Thus hot spots appear black against a
bright background. The temperature sensitivity is better than 0.5&#8451; and the spatial resolution better than 5 microns.
The technique has distinct advantages over alternative methods of measuring microcircuit temperatures. Examples
of applications in support of design evaluation and fault diagnosis of monolithic circuits illustrate the benefits of
visual information obtained. The ready application of the technique to the large planar areas of thick film resistors
has enabled the location of hot spots &#8211; confirming their occurrence at the end of laser cuts &#8211; and the measurement
of thermal resistances of resistors either singly or in arrays &#8211; showing that substantial heat conduction through the
substrate can outweigh local non-uniformities in dissipation. Applications extend beyond the supportive role to
reliability evaluation illustrated in this paper.

A Technique for the Measurement of Hot Spots and Isotherm Profiles
at the Surfaces of the Elements of Hybrid Microcircuits

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Active and Passive Electronic Components provides a forum for the science and technology of all types of electronic components, and publishes experimental and theoretical papers on topics such as transistors, hybrid circuits and sensors.

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Active and Passive Electronic Components

The Second European Hybrid Microelectronics Conference. Part I

The Second European Hybrid Microelectronics Conference. Part I

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