Volume 10 [49 articles]

• Editorial
  Volume 10 (1983), Issue 4, Pages 197-197
• Computer Aided Design of Hybrid Circuits, G. P. Ferraris, T. Cagnin, F. Francese, and L. Piana
  Volume 10 (1983), Issue 4, Pages 199-208
• Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits, Ch. Zimmer
  Volume 10 (1983), Issue 4, Pages 209-216
• Silicon and Hybrid Micro-Electronic Sensors, S. Middelhoek, D. J. W. Noorlag, and G. K. Steenvoorden
  Volume 10 (1983), Issue 4, Pages 217-229
• Hybrids for Automotive Applications, Dietrich Bergfried
  Volume 10 (1983), Issue 4, Pages 231-236
• Guidelines for Finer Lines in Thick Film Circuitry, P. J. B. Bertrams, W. Keuper, G. Koch, and J. H. C. Van Mourik
  Volume 10 (1983), Issue 4, Pages 237-245
• The Influence of Contaminants During the Firing of Inks, A. J. M. Van Gorp and J. H. C. Van Mourik
  Volume 10 (1983), Issue 4, Pages 247-254
• Thick Film Fail-Safe Resistors, St. Nowak and D. L. Wojcicka
  Volume 10 (1983), Issue 4, Pages 255-260
• A Large Scale Hybrid Thermal Print Head, Tamio Saito, Yoshikatsu Fukumoto, Mamoru Mizuguchi, Takahiko Abe, and Masayoshi Nagashima
  Volume 10 (1983), Issue 4, Pages 261-267
• Parameters That Influence the Ultrasonic Bond Quality, P. L. L. M. Derks
  Volume 10 (1983), Issue 4, Pages 269-275