Volume 10 [49 articles]

• Publisher's Note
  Volume 10 (1982), Issue 1, Pages i-i
• Direct Chip Mounting — A Challenge to the Design Engineer, J. Lorman and J. Prochaska
  Volume 10 (1982), Issue 1, Pages 1-6
• New Single-Capacitor Simulations of Floating Inductors, R. Senani
  Volume 10 (1982), Issue 1, Pages 7-12
• Surface Mounting of Leadless Chip Carriers on Various Printed Circuit Board Type Substrates, I. G. Lang
  Volume 10 (1982), Issue 1, Pages 13-21
• An Original Interconnection Technique for an Electronic Payment Card, M. Monnier and M. Monneraye
  Volume 10 (1982), Issue 1, Pages 23-29
• Multi-Chip Module Technology, R. A. Rinne and D. R. Barbour
  Volume 10 (1982), Issue 1, Pages 31-49
• Density Upgrading in Tape Automated Bonding, K. Kurzweil and G. Dehaine
  Volume 10 (1982), Issue 1, Pages 51-55
• Conference Diary
  Volume 10 (1982), Issue 1, Pages 57-58
• Announcement
  Volume 10 (1982), Issue 1, Pages 59-59
• Editorial, D. S. Campbell
  Volume 10 (1983), Issue 2-3, Pages 61-61
• Temperature Verification of Hybrid Microelectronic Circuit Design, Sedat Širbegović, Milan Mazalica, and Ratko Krčmar
  Volume 10 (1983), Issue 2-3, Pages 63-66
• Hybrid Circuit for Stimulated Bone Regrowth, R. Govaerts, W. Sansen, and F. de Dijcker
  Volume 10 (1983), Issue 2-3, Pages 67-70
• Displays, A. Schauer
  Volume 10 (1983), Issue 2-3, Pages 71-80
• Current Noise in Thick and Thin Film Resistors, S. Demolder, A. Van Calster, and M. Vandendriessche
  Volume 10 (1983), Issue 2-3, Pages 81-85
• An Electromyographically Controlled Elbow Locking Mechanism for an Upper Limb Prosthesis, H. T. Law and J. J. Hewson
  Volume 10 (1983), Issue 2-3, Pages 87-93
• New Thick-Film Temperature Sensors Applied in Some Hybrid Measurement Devices, Janusz J. Gondek and Marek A. Wójcicki
  Volume 10 (1983), Issue 2-3, Pages 95-102
• A Simulative Approach to Electron Conduction in Thick-Film Resistors, C. Jacoboni, M. Prudenziati, and A. Rizzi
  Volume 10 (1983), Issue 2-3, Pages 103-110
• Mounting of Micropackages in Vapour Phase Soldering and Study of Ageing Mechanism, Christian M. Val and Jacques D. Agniel
  Volume 10 (1983), Issue 2-3, Pages 111-127
• The Use of Hybrid Microelectronics in the Construction of Ion-Selective Electrodes, S. I. Leppävuori and P. S. Romppainen
  Volume 10 (1983), Issue 2-3, Pages 129-133
• Experience With Polymer Thick Film Technology, Raimo Hulkkonen, Eero Jarvinen, and Vesa Sortti
  Volume 10 (1983), Issue 2-3, Pages 135-141
• Ceramic on Metal Substrates Produced by Plasma Spraying for Thick Film Technology, Leszek Gołonka and Lech Pawłowski
  Volume 10 (1983), Issue 2-3, Pages 143-150
• Digital Carbon Monoxide Detector /11/, J. P. Dauchot, A. Hecq, and M. T. Grognia
  Volume 10 (1983), Issue 2-3, Pages 151-156
• Experimental and Theoretical Characterization of Thick and Thin Films for Microwave Uses on 99.6% Alumina Substrates, J. P. Ramy, R. Schnitzler, and C. Thebault
  Volume 10 (1983), Issue 2-3, Pages 157-162
• Evaluation of Du Pont Copper-Compatible Resistor System, M. V. Coleman and G. E. Gurnett
  Volume 10 (1983), Issue 2-3, Pages 163-170
• Computer Simulation of Hybrid Integrated Circuits Including Combined Electrical and Thermal Effects, Carl R. Zimmer
  Volume 10 (1983), Issue 2-3, Pages 171-176
• Enamelled Steel Substrates for Printed Circuits, R. Kužel and J. Broukal
  Volume 10 (1983), Issue 2-3, Pages 177-183
• Thin Film Transistors and Thin Film Transistor Circuits, Andre Van Calster
  Volume 10 (1983), Issue 2-3, Pages 185-189
• Announcement
  Volume 10 (1983), Issue 2-3, Pages 190-190
• Conference Diary
  Volume 10 (1983), Issue 2-3, Pages 191-193
• Book Reviews
  Volume 10 (1983), Issue 2-3, Pages 194-195
• Editorial
  Volume 10 (1983), Issue 4, Pages 197-197
• Computer Aided Design of Hybrid Circuits, G. P. Ferraris, T. Cagnin, F. Francese, and L. Piana
  Volume 10 (1983), Issue 4, Pages 199-208
• Versatile Packaging Concept Using Thick Film Hybrids for Analog and Digital Circuits, Ch. Zimmer
  Volume 10 (1983), Issue 4, Pages 209-216
• Silicon and Hybrid Micro-Electronic Sensors, S. Middelhoek, D. J. W. Noorlag, and G. K. Steenvoorden
  Volume 10 (1983), Issue 4, Pages 217-229
• Hybrids for Automotive Applications, Dietrich Bergfried
  Volume 10 (1983), Issue 4, Pages 231-236
• Guidelines for Finer Lines in Thick Film Circuitry, P. J. B. Bertrams, W. Keuper, G. Koch, and J. H. C. Van Mourik
  Volume 10 (1983), Issue 4, Pages 237-245
• The Influence of Contaminants During the Firing of Inks, A. J. M. Van Gorp and J. H. C. Van Mourik
  Volume 10 (1983), Issue 4, Pages 247-254
• Thick Film Fail-Safe Resistors, St. Nowak and D. L. Wojcicka
  Volume 10 (1983), Issue 4, Pages 255-260
• A Large Scale Hybrid Thermal Print Head, Tamio Saito, Yoshikatsu Fukumoto, Mamoru Mizuguchi, Takahiko Abe, and Masayoshi Nagashima
  Volume 10 (1983), Issue 4, Pages 261-267
• Parameters That Influence the Ultrasonic Bond Quality, P. L. L. M. Derks
  Volume 10 (1983), Issue 4, Pages 269-275
• The Influence of Conductor Particle Size Distribution on the Blending Curve of Epoxy-Based Thick Film Resistors, Bulent Ulug, John M. Robertson, and Peter J. S. Ewen
  Volume 10 (1983), Issue 4, Pages 277-284
• Electrical Transport in Thick Film (Cermet) Resistors, Maria Prudenziati
  Volume 10 (1983), Issue 4, Pages 285-293
• Comparative Study of Thick Film Dielectrics, Walter Vermeirsch
  Volume 10 (1983), Issue 4, Pages 295-309
• Design of a 108 Pin VLSI Package With Low Thermal Resistance, Kanji Otsuka and Tamotsu Usami
  Volume 10 (1983), Issue 4, Pages 311-316
• Description and Performance of a Novel Concept “Single Level” Ceramic Chip Carrier, Andre de Keyser, Claude Delautre, and Guy Nameche
  Volume 10 (1983), Issue 4, Pages 317-321
• Towards a More Thorough Paste Specification, Peter Barnwell
  Volume 10 (1983), Issue 4, Pages 323-326
• Announcement
  Volume 10 (1983), Issue 4, Pages 327-327
• Conference Diary
  Volume 10 (1983), Issue 4, Pages 328-331
• Book Review, D. S. Campbell
  Volume 10 (1983), Issue 4, Pages 332-332