Volume 11 [46 articles]

• Book Review, D. S. Campbell
  Volume 11 (1983), Issue 1, Pages 93-94
• Conference Report, J. M. Herbert
  Volume 11 (1983), Issue 1, Pages 95-96
• Mid-Film Interconnects for Multilayer Microcircuit Packages, R. Sue and H. M. Naguib
  Volume 11 (1984), Issue 2, Pages 97-108
• Fine Lines in a Three Dimensional Interconnect, J. A. Scarlett
  Volume 11 (1984), Issue 2, Pages 109-115
• Wire Laying Methods as an Alternative to Multilayer PCB's, G. Messner, P. Plonski, and A. Martens
  Volume 11 (1984), Issue 2, Pages 117-122
• Measurement of the Tunneling and Hopping Parameters in RuO₂ Thick Films, N. C. Halder and R. J. Snyder
  Volume 11 (1984), Issue 2, Pages 123-136
• The Oxide-Forming Role of Water in Aluminum Electrolytic Capacitors, Walter J. Bernard and Steven M. Florio
  Volume 11 (1984), Issue 2, Pages 137-145
• Thick-Film Non-Reciprocal Ferrite Elements and Gunn Hybrid Oscillators in Modified Thick-Film Technology, Janusz J. Gondek, Jan Koprowski, and Marek A. Wójcicki
  Volume 11 (1984), Issue 2, Pages 147-156
• The Influence of Air-Abrasive Trimming on the Current Noise of Thick Film Resistors, M. Wolf
  Volume 11 (1984), Issue 2, Pages 157-158
• Card-Edge Connector Reliability, Poul Villien
  Volume 11 (1984), Issue 2, Pages 159-164