Volume 11 [46 articles]

• New Thick-Film Microwave Elements for Microwave Integrated Circuits, Janusz J. Gondek, Marek A. Wójcicki, and Jan Cąber
  Volume 11 (1983), Issue 1, Pages 1-20
• Electron Tunneling and Hopping Possibilites in RuO₂ Thick Films, N. C. Halder
  Volume 11 (1983), Issue 1, Pages 21-34
• A Short Communication — Determination of Chip and Substrate Temperatures, M. R. Haskard
  Volume 11 (1983), Issue 1, Pages 35-41
• Electrical Properties of RF Sputtered NiCr Thin Film Resistors With Cu Contacts, R. K. Nahar and N. M. Devashrayee
  Volume 11 (1983), Issue 1, Pages 43-51
• Improvements in Multilayer Ceramic Capacitors, A. F. Dyson
  Volume 11 (1983), Issue 1, Pages 53-64
• Some Useful Design Parameters of Non-Uniform Integrated Band-Pass Filters, H. R. Singh
  Volume 11 (1983), Issue 1, Pages 65-70
• Reliability Assessment and Screening by Reliability Indicator Methods, Jørgen Møltoft
  Volume 11 (1983), Issue 1, Pages 71-84
• Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials, R. V. Allen
  Volume 11 (1983), Issue 1, Pages 85-87
• Announcement
  Volume 11 (1983), Issue 1, Pages 89-89
• Conference Diary
  Volume 11 (1983), Issue 1, Pages 90-92
• Book Review, D. S. Campbell
  Volume 11 (1983), Issue 1, Pages 93-94
• Conference Report, J. M. Herbert
  Volume 11 (1983), Issue 1, Pages 95-96
• Mid-Film Interconnects for Multilayer Microcircuit Packages, R. Sue and H. M. Naguib
  Volume 11 (1984), Issue 2, Pages 97-108
• Fine Lines in a Three Dimensional Interconnect, J. A. Scarlett
  Volume 11 (1984), Issue 2, Pages 109-115
• Wire Laying Methods as an Alternative to Multilayer PCB's, G. Messner, P. Plonski, and A. Martens
  Volume 11 (1984), Issue 2, Pages 117-122
• Measurement of the Tunneling and Hopping Parameters in RuO₂ Thick Films, N. C. Halder and R. J. Snyder
  Volume 11 (1984), Issue 2, Pages 123-136
• The Oxide-Forming Role of Water in Aluminum Electrolytic Capacitors, Walter J. Bernard and Steven M. Florio
  Volume 11 (1984), Issue 2, Pages 137-145
• Thick-Film Non-Reciprocal Ferrite Elements and Gunn Hybrid Oscillators in Modified Thick-Film Technology, Janusz J. Gondek, Jan Koprowski, and Marek A. Wójcicki
  Volume 11 (1984), Issue 2, Pages 147-156
• The Influence of Air-Abrasive Trimming on the Current Noise of Thick Film Resistors, M. Wolf
  Volume 11 (1984), Issue 2, Pages 157-158
• Card-Edge Connector Reliability, Poul Villien
  Volume 11 (1984), Issue 2, Pages 159-164
• Compliant Press-Fit Technology Integrated Into a New Back Panel Packaging Approach, A. Kerkhoff
  Volume 11 (1984), Issue 2, Pages 165-172
• Fabrication of Schottky-Barrier Diodes Using a Thick Film Technique, R. Sarin and Y. R. Pradeep
  Volume 11 (1984), Issue 2, Pages 173-174
• Evaporation Characteristics of Electron Beam Gun Heated Sources, Paul C. Baynes and T. Nagarajan
  Volume 11 (1984), Issue 2, Pages 175-183
• Model for Reliability Prediction of Thick Film Resistors, R. B. Pranchov and D. S. Campbell
  Volume 11 (1984), Issue 2, Pages 185-190
• Announcement
  Volume 11 (1984), Issue 2, Pages 191-191
• Conference Diary
  Volume 11 (1984), Issue 2, Pages 192-193
• Editorial, V. Rysanek
  Volume 11 (1984), Issue 3, Pages 195-195
• The Use of the Non-Contacting Temperature Measuring Techniques in the Early Detection of Hidden Faults in Electronic Components, P. Trägner
  Volume 11 (1984), Issue 3, Pages 197-201
• Noise Investigations on Thick Film Resistors, A. Ambrozy and G. Wollitzer
  Volume 11 (1984), Issue 3, Pages 203-207
• Analysis of Thin Film Fire Sensors, G. Zentai and Zs. Illyefalvi-Vitéz
  Volume 11 (1984), Issue 3, Pages 209-214
• Methods of Checking Printed Circuits, I. Hajdu, P. Bánlaki, J. Pinkola, and E. Tóth
  Volume 11 (1984), Issue 3, Pages 215-217
• Examination of Thick-Films Using Modern Surface Analytical Techniques, G. Harsányi and G. Ripka
  Volume 11 (1984), Issue 3, Pages 219-223
• Usage of Sims and Auger Test Methods in the Production of Multilayer Printed Circuit Boards, E. Toth, P. Banlaki, I. Hajdu, and J. Pinkola
  Volume 11 (1984), Issue 3, Pages 225-229
• Active Trimming of Hybrid Integrated Circuits, P. Németh and P. Krémer
  Volume 11 (1984), Issue 3, Pages 231-235
• Scratch-Profiles Study in Thin Films Using SEM and EDS, M. El-Shabasy, L. Pogány, G. Konczos, E. Hajtó, and B. Szikora
  Volume 11 (1984), Issue 3, Pages 237-241
• Inaccuracies of Measuring Methods and Their Influence on the Regression Function, W. Sauer
  Volume 11 (1984), Issue 3, Pages 243-247
• Announcement
  Volume 11 (1984), Issue 3, Pages 249-250
• Conference Diary
  Volume 11 (1984), Issue 3, Pages 251-253
• On Experimental Data of the TCR of TFRs and Their Relation to Theoretical Models of Conduction Mechanism, I. Storbeck and M. Wolf
  Volume 11 (1985), Issue 4, Pages 255-259
• Reliability Compliance Testing of Electronic Components for Consumer Electronics, E. Przybyl and E. Peciakowski
  Volume 11 (1985), Issue 4, Pages 261-270
• Reproducibility of Properties of SnO_x Thin Films Prepared by Reactive Sputtering, Grazyna Beensh-Marchwicka and Lubomila Krol-Stepniewska
  Volume 11 (1985), Issue 4, Pages 271-280
• Electrochemical Migration in Thick-Film IC-S, Gabor Ripka and Gabor Harsanyi
  Volume 11 (1985), Issue 4, Pages 281-290
• Stability Observations and Surface Analysis of Air Fired Nickel Thick Film Conductors, R. B. Pranchov and D. S. Campbell
  Volume 11 (1985), Issue 4, Pages 291-297
• Optical Fibre Connectors for Harsh Environments, J. C. Challans
  Volume 11 (1985), Issue 4, Pages 299-304
• Announcement
  Volume 11 (1985), Issue 4, Pages 305-306
• Conference Diary
  Volume 11 (1985), Issue 4, Pages 307-308