Volume 9 [53 articles]

Regular Issue Articles [40 articles]

• Advances in Low Cost Silver-Containing Thick Film Conductors, Barry E. Taylor, John J. Felten, Samuel J. Horowitz, John R. Larry, and Richard M. Rosenberg
  Volume 9 (1981), Issue 1, Pages 67-85
• Reliability Considerations of Flip Chip Components for Automotive Electronic Applications, Keisuke Sugiyama, Isao Bansaku, Naoharu Tsuzimoto, and Iwao Tachikawa
  Volume 9 (1981), Issue 1, Pages 87-92
• New Du Pont Composition Applied in Thick-Film Temperature and Humidity Sensors, Janusz J. Gondek and Marek A. Wójcicki
  Volume 9 (1981), Issue 1, Pages 93-100
• Conference Diary
  Volume 9 (1981), Issue 1, Pages 101-102
• Announcement
  Volume 9 (1981), Issue 1, Pages 103-103
• Editorial, D. S. Campbell
  Volume 9 (1981), Issue 2, Pages i-i
• Response to Comments on Paper on Grain Boundary Scattering Model for Metals, F. Warkusz
  Volume 9 (1981), Issue 2, Pages 105-109
• The Influence of the Area of a Thin Film Capacitor on the Breakdown Voltage, T. Berlicki
  Volume 9 (1981), Issue 2, Pages 111-114
• The Influence of Filter Parameters on the Response of Ceramic Filters Operating in the Thickness-Twist Mode, S. Leppävuori and P. Ruuska
  Volume 9 (1981), Issue 2, Pages 115-124
• Three Dimensional Analytical Separation of Grain Boundary and Surface Scatterings in Polycrystalline Metal Films in the Case of Non Cubic Grains, C. R. Tellier, C. R. Pichard, and A. J. Tosser
  Volume 9 (1981), Issue 2, Pages 125-130