Volume 9 [53 articles]
Regular Issue Articles [40 articles]
All | 1-10 | 11-20 | 21-30 | 31-40
- Thick Film Circuits: Present State and Future
Development, J. Novotny
Volume 9 (1981), Issue 2, Pages 131-137 - Permanent Interconnection Technology
Electronic Interconnections – the Printed
Wiring Board, I. G. Lang
Volume 9 (1981), Issue 2, Pages 139-145 - Thick Film Capacitor Materials of the
Powder–Glass Binary Systems and Their
Dielectric Properties, Akira Ikegami, Hideo Arima, and Katsuo Abe
Volume 9 (1981), Issue 2, Pages 147-152 - Application-Oriented Description of the Quality
of Electronic Components (ppm Concept), Wolfgang Junghans
Volume 9 (1981), Issue 2, Pages 153-156 - The Application of New Du Pont/USA/Copper
Composition for Manufacturing of Thick-Film
Microwave Low Loss Resonators on L and X Band, Janusz J. Gondek, Marek A. Wojcicki, and Jan Koprowski
Volume 9 (1981), Issue 2, Pages 157-163 - Conference Report, K. L. Mittal
Volume 9 (1981), Issue 2, Pages 165-166 - Conference Diary
Volume 9 (1981), Issue 2, Pages 167-168 - Announcement
Volume 9 (1981), Issue 2, Pages 169-169 - Defect Density and Electrical Properties of
Vacuum Evaporated Copper Films From
Annealing Studies of Electrical Resistance, K. Narayandas, M. Radhakrishnan, and C. Balasubramanian
Volume 9 (1982), Issue 3, Pages 171-178 - Effect of Firing Temperature and Glass Content
on the Electrical Properties of Thick Film
Capacitors, S. Leppävuori and A. Uusimäki
Volume 9 (1982), Issue 3, Pages 179-184