Intelligent Audio, Speech, and Music Processing Applications
Call for Papers
Future audio, speech, and music processing applications need innovative intelligent algorithms that allow for human/environmental-based interactive interfaces with surrounding devices/systems in real-world settings. The need exists to control, process, render, and playback/project sound signals for different platforms under a diverse range of listening environments. The presence of these intelligent audio, speech, and music processing applications will create an environment that is sensitive, adaptive, and responsive to the presence of users.
Generally, three areas of research are considered, namely, analysis, communication, and interaction. Analysis covers both preprocessing of sound signals and extraction of information from the environment. Communication covers the transmission path/network, coding techniques, and conversion between spatial audio formats. The final area involves intelligent interaction with the audio/speech/music environment based on the users' location, signal information, and acoustical environment.
This special issue includes a variety of intelligent devices and applications working together to create an integral audio experience/environment for the users. A vision of intelligent signal processing environments and applications can also be proposed and describe how new audio/speech/music applications can enhance everyday entertainment as well as human communication experiences.
Topics of interest include (but are not limited to):
- 3D and spatial audio
- Automotive audio
- Audio/speech installation
- Audio network
- Audio/speech delivery
- Audio/speech for mobile and handheld/wearable devices
- Environmental noise control—active & passive
- Embedded audio/speech intelligence
- Intelligent speech communication
- Coding techniques
- Music processing
- Personal soundscape/personal audio space
- Speech enhancement
- New applications/domains
Authors should follow the EURASIP Journal on Audio, Speech, and Music Processing manuscript format described at the journal site http://www.hindawi.com/journals/asmp/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/, according to the following timetable:
| Manuscript Due | January 1, 2008 |
| First Round of Reviews | March 1, 2008 |
| Publication Date | July 1, 2008 |
Guest Editors
- Woon-Seng Gan, Digital Signal Processing Laboratory, School of Electrical and Electronic Engineering, Nanyang Technological University, 50 Nanyang Avenue, Singapore 639798
- Sen M. Kuo, Department of Electrical Engineering, Northern Illinois University, Dekalb, IL 60115, USA
- John H. L. Hansen, Department of Electrical Engineering, University of Texas at Dallas, Richardson, TX 75083, USA