Challenges on Complexity and Connectivity in Embedded Systems
Call for Papers
Technology advances and a growing field of applications have been a constant driving factor for embedded systems over the past years. However, the increasing complexity of embedded systems and the emerging trend to interconnections between them lead to new challenges. Intelligent solutions are necessary to solve these challenges and to provide reliable and secure systems to the customer under a strict time and financial budget.
Typically, intelligent solutions often come up with an orthogonal and interdisciplinary approach in contrast to traditional ways of engineering solutions. Many possible intelligent methods for embedded systems are biologically inspired, such as neural networks and genetic algorithms. Multiagent systems are also prospective for an application for nontime critical services of embedded systems. Another field is soft computing which allows a sophisticated modeling and processing of imprecise (sensory) data.
The goal of this special issue is to provide a forum for innovative smart solutions which have been applied in the embedded systems domain and which are likely useful to solve problems in other applications as well.
Original papers previously unpublished and not currently under review by another journal are solicited. They should cover one or more of the following topics:
- Smart embedded (real-time) systems
- Autonomous embedded systems
- Sensor networks and sensor node hardware/software platforms
- Software tools for embedded systems
- Topology control and time synchronization
- Error tolerance, security, and robustness
- Network protocols and middleware for embedded systems
- Standardization of embedded software components
- Data gathering, aggregation, and dissemination
- Prototypes, applications, case studies, and test beds
Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/es/guidelines.html. Authors should follow the EURASIP Journal on Embedded Systems manuscript format described at the journal's site http://www.hindawi.com/journals/es/. Prospective authors should submit an electronic copy of their complete manuscript through the journal's Manuscript Tracking System at http://mts.hindawi.com/, according to the following timetable:
| Manuscript Due | August 1, 2008 |
| First Round of Reviews | November 1, 2008 |
| Publication Date | February 1, 2009 |
Guest Editors
- Bernhard Rinner, University of Klagenfurt, 9020 Klagenfurt, Austria
- Wilfried Elmenreich, University of Klagenfurt, 9020 Klagenfurt, Austria
- Ralf Seepold, Universidad Carlos III de Madrid, 28911 Leganes, Spain
- Volker Turau, Technische Universität Hamburg-Harburg, 21073 Hamburg, Germany
- Markus Kucera, University of Applied Sciences, Regensburg, Germany
