Effect of Isopropyl Alcohol Concentration and Etching Time on Wet Chemical Anisotropic Etching of Low-Resistivity Crystalline Silicon Wafer

Table 2

Texture parameters of Si wafers surface at different .

(% vol.)	(μm)	RMS (μm)	(μm)	Coverage ratio (%)
2	1.57	0.37	0.48	85.1
4	1.32	0.30	0.42	94.7
6	1.29	0.29	0.39	95.3
8	1.27	0.22	0.33	93.8
10	0.98	0.18	0.28	93.6