FDTD-SPICE for Characterizing Metamaterials Integrated with Electronic Circuits

<table>(a) RLC circuit configuration and (b) its impedance <svg height="10.325" id="M17" style="vertical-align:-0.0pt" version="1.1" viewbox="0 0 13.2875 10.325" width="13.2875" xmlns="http://www.w3.org/2000/svg">
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<tspan style="font-size: 12.50px; " x="0" y="0">𝑍</tspan>
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International Journal of Antennas and Propagation

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Figure 3

Figure 3: FDTD-SPICE for Characterizing Metamaterials Integrated with Electronic Circuits 