Small Antenna Based on MEMS and Metamaterial Properties for Reconfigurable Applications
Figure 8
Fabrication process. (a) Standard wafer cleaning followed by the thermal growth of SiO2, (b) 0.5 μm-thick titanium deposited by sputtering, (c) 1.5 μm-thick aluminum deposited by sputtering, (d) ground plane patterned with Ti and Al by lithography, (e) dimples formed by SU8-2002 pattering, (f) AZ-4260 sacrificial layer forming, (g) definition of anchor by pattering, (h) Ti-Al deposited by sputtering and (i) MEMS release process.
