Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology

Figure 7

Electric field intensity distribution in the package cavity, (a) model of the package near the feed, (b) model of the package offset 2 mm from the feed along -axis and -axis, respectively, (c) model of the package offset 5 mm from the feed along -axis, and (d) model of the package offset 7 mm from the feed along -axis.

(a)

(b)

(c)

(d)