Compact Shorted Stacked-Patch Antenna Integrated with Chip-Package Based on LTCC Technology

Figure 9

Electric field intensity distribution in the package cavity versus different radii of the grounded vias with the number of vias of 56, (a) 0.2 mm, (b) 0.4 mm, and (c) 0.6 mm.

(a)

(b)

(c)