Research Article

A Comparative Study between Via-Hole and Via-Free Grounded Coplanar Waveguide to Microstrip Transitions on Thin Polymer Substrate

Figure 8

Measured and simulated -parameters of via-free back-to-back GCPW-MS-GCPW transition realized on 20 μm BCB polymer substrate for = 54 μm, = 25 μm, = 1 mm, = 1 mm, = 1 cm, and 2 μm thick copper metallization.