A Novel Microstrip-to-Microstrip Vertical Via Transition in X-Band Multilayer Packages

Table 2

Parameters of matching pads loaded signals via transition investigation (unit: mm).

Coax-like section		Match-pad and antipad (all layers of ground plane)
4.35	3.2
Through-hole via			0.88	0.9	0.9
			1	1.1	1
0.3	0.225		1.2	1.2	1.2