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Reconfigurable Electromagnetics through Metamaterials

Call for Papers

In recent years there has been a growing interest in the development of artificial materials, and in particular in metamaterials, engineered in order to exhibit electromagnetic (EM) properties that do not occur in nature. The wide enthusiasm in EM metamaterials stems from their ability to manipulate and channel electromagnetic waves in novel ways, which is derived from their subwavelength structure/granularity, rather than being based solely on their constitutive materials. These features of EM metamaterials promise a path toward completely new devices with properties and functionality not possible with currently available technologies. This is specifically true whenever reconfigurability is of interest (e.g., for novel or nonconventional applications in telecommunications, medicine, security, etc.). Indeed, thanks to their intrinsic structure, EM metamaterials represent a key tool to implement the “Reconfigurable Electromagnetics” paradigm, that is, to design and fabricate devices which can be controlled through a change of the physical properties of their constitutive materials at a subwavelength scale.

In this framework, this special issue is aimed at reviewing the most recent advances of metamaterials as an enabling technology for the design and realization of reconfigurable devices at RF and THz optical frequencies. Accordingly, potential topics include, but are not limited to:

  • Development of reconfigurable devices including reconfigurable metasurfaces/metamaterials in the range from RF to THz frequencies
  • Innovative integrated design approaches to enable “Reconfigurable Electromagnetics” through EM metamaterials
  • Recent progress in design and modeling/fabrication of 2D/3D reconfigurable bulk EM metamaterials
  • New numerical modeling and computational methods for reconfigurable EM metamaterials
  • Reconfigurable mechatronics and metadevices

Before submission authors should carefully read over the journal’s Author Guidelines, which are located at http://www.hindawi.com/journals/ijap/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijap/retm/ according to the following timetable:

Manuscript DueFriday, 18 October 2013
First Round of ReviewsFriday, 10 January 2014
Publication DateFriday, 7 March 2014

Lead Guest Editor

  • Giacomo Oliveri, ELEDIA Research Center, University of Trento, 38123 Trento, Italy

Guest Editors

  • Douglas Werner, Department of Electrical Engineering, Pennsylvania State University, University Park, PA 16802,USA
  • Filiberto Bilotti, Department of Applied Electronics, University of Rome Tre, 00146 Rome, Italy
  • Christophe Craeye, Ecole Polytechnique de Louvain, Université Catholique de Louvain, 1348 Louvain-la-Neuve, Belgium