Electroless Deposition of Ni-Cu-P Coatings Containing Nano-Al2O3 Particles and Study of Its Corrosion Protective Behaviour in 0.5 M H2SO4

<table class="table-group" id="tab1"><tr><td><table class="table"><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr class="thead"><td align="left">Substance</td><td align="center">Concentration (g/L)</td></tr><tr><td class="thead-hr" colspan="2"><hr/></td></tr><tr><td align="left">
 NiSO4·2H2O</td><td align="center">25</td></tr><tr><td align="left">NaH2PO2</td><td align="center">25</td></tr><tr><td align="left">Sodium acetate</td><td align="center">20</td></tr><tr><td align="left">Sodium citrate</td><td align="center">60</td></tr><tr><td align="left">CuSO4</td><td align="center">1</td></tr><tr><td align="left">Thiourea</td><td align="center">0.001</td></tr><tr><td align="left">Surfactant</td><td align="center">0.003</td></tr><tr><td align="center" colspan="2">pH = 10 ± 0.2</td></tr><tr class="table-tr"><td colspan="2"><hr class="tbody-hr"/></td></tr></table></td></tr></table>

Chemical composition of electroless plating bath.

International Journal of Corrosion

tab1

Table 1

Table 1: Electroless Deposition of Ni-Cu-P Coatings Containing Nano-Al2O3 Particles and Study of Its Corrosion Protective Behaviour in 0.5 M H2SO4