Interaction in Augmented Smart Environments

Call for Papers

Digitally augmented environments facilitate accessing additional layers of virtual information and services, which are conceptually linked to real references (objects, spaces, people, interfaces, sensors, etc.). In order to interface with these invisible layers, novel interaction models are being developed. Following the usability paradigm ‘easy to learn, easy to use,’ most of these models rely on real-time data acquired from different sensing devices: mobile devices, wearable sensors, hybrid sensors, or sensor networks. All in all, the final objective is to enable an enjoyable and efficient way to interface with a highly responsive environment, facilitating traditional tasks but also making possible a new user experience.

This special issue aims to gather original and visionary advances of new sensor-based interaction concepts in digitally augmented environments. Potential topics include, but are not limited to:

• Sensor fusion technologies for interaction
• Sensing solutions for hybrid natural interfaces: voice, touch, and gesture-based concepts
• Tangible/graspable interfaces and smart objects
• Sensors and data fusion techniques for gaze tracking systems
• Interfaces based on mobile sensors
• Sensing technologies to enhance the experience of augmented reality
• Hybrid sensing for identification and authentication
• Methodologies to design sensor-based user interfaces
• Holistic sensing systems and interaction models in different scenarios: health, surgery, education, smart home, support to independent living, leisure and gaming, scene personalization, etc
• User validation studies

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/ijdsn/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijdsn/iase/ according to the following timetable:

Lead Guest Editor

• Ana M. Bernardos, Telecommunications Engineering School, Technical University of Madrid (UPM), Madrid, Spain

Guest Editors

• Juan A. Besada, Telecommunications Engineering School, Technical University of Madrid (UPM), Madrid, Spain
• Boon-Chong Seet, Department of Electrical and Electronic Engineering, Auckland University of Technology, Auckland, New Zealand
• Elisabetta Farella, Department of Electronics, Computer Science and System, University of Bologna, Bologna, Italy