Process to Improve the Adherences of Copper to a PTFE Plate

Table 1

Process conditions at the RIE for Cu adherence to the polished Teflon.

Pressure (mTorrs)	Power (watts)	Flow (SCCM)
30	250	30
10	250	30
5	250	30
30	250	20
10	250	20
5	250	20
30	250	10
10	250	10
5	250	10
30	150	30
10	150	30
5	150	30
30	150	20
10	150	20
5	150	20
30	150	10
10	150	10
5	150	10
30	100	30
10	100	30
5	100	30
30	100	20
10	100	20
5	100	20
30	100	10
10	100	10
5	100	10

SCCM is standard cubic centimeters per minute, a flow measurement term indicating cm³/min at a standard temperature and pressure.