Editorial Board

• Iltcho M. Angelov, Chalmers University of Technology, Sweden
• Herve Aubert, Université de Toulouse, France
• Giancarlo Bartolucci, University of Rome “Tor Vergata”, Italy
• Tanmay Basak, Indian Institute of Technology Madras, India
• Eric Bergeault, École d'Ingénieurs Télécom ParisTech, France
• Pazhoor V. Bijumon, Royal Military College of Canada, Canada
• Fabrizio Bonani, Politecnico di Torino, Italy
• Mattia Borgarino, Università di Modena e Reggio Emilia, Italy
• Maurizio Bozzi, University of Pavia, Italy
• Nuno Borges Carvalho, Instituto de Telecomunicacoes - DETI - Universidade de Aveiro, Portugal
• Robert H. Caverly, Villanova University, USA
• Yinchao Chen, University of South Carolina, USA
• Wen-Shan Chen, Southern Taiwan University, Taiwan
• Carlos E. Christoffersen, Lakehead University, Canada
• Paolo Colantonio, Università di Roma Tor Vergata, Italy
• Carlos Collado, Universitat Politècnica de Catalunya, Spain
• Ali Mohamed Darwish, The American University in Cairo, Egypt
• Afshin Daryoush, Drexel University, USA
• Walter De Raedt, IMEC, Belgium
• Didier J. Decoster, Université des Sciences et Technologies de Lille, France
• Qianqian Fang, Massachusetts General Hospital/Harvard University, USA
• Fabio Filicori, Università di Bologna, Italy
• Manuel Freire, Universidad de Sevilla, Spain
• Edward Gebara, Georgia Institute of Technology, USA
• Giovanni Ghione, Politecnico di Torino, Italy
• Ramon Gonzalo, Universidad Pública de Navarra, Spain
• Gian Luigi Gragnani, Università degli Studi di Genova, Italy
• Yong Xin Guo, National University of Singapore, Singapore
• Mridula Gupta, University of Delhi South Campus, India
• Wenlong He, University of Strathclyde, United Kingdom
• Tzyy-Sheng Horng, National Sun Yat-Sen University, Taiwan
• Yasushi Itoh, Shonan Institute of Technology, Japan
• Kenji Itoh, Mitsubishi electric, Japan
• Yong-Woong Jang, Keuckdong College, Korea
• Hideki Kamitsuna, NTT Photonics Laboratories;NTT Corporation, Japan
• Nemai Karmakar, Monash University, Australia
• Dmitry Kholodnyak, St. Petersburg Electrotechnical University "LETI", Russia
• Erik L. Kollberg, Chalmers University of Technology, Sweden
• Igor A. Kossyi, Russian Academy of Sciences, Russia
• Slawomir Koziel, Reykjavik University, Iceland
• Miguel Laso, Universidad Pública de Navarra, Spain
• Chang-Ho Lee, Qualcomm, USA
• Ernesto Limiti, Università degli Studi di Roma "Tor Vergata", Italy
• Fujiang Lin, Agency for Science, Technology and Research, Singapore
• Yo Shen Lin, National Central University, Taiwan
• Alayn Loayssa, Universidad Pública de Navarra, Spain
• Giampiero Lovat, "La Sapienza" University of Rome, Italy
• Bruno Maffei, University of Manchester, United Kingdom
• Gianfranco F. Manes, Università degli Studi di Firenze, Italy
• Jan-Erik Mueller, Infineon Technologies, Germany
• Krishna Naishadham, Georgia Institute of Technology, USA
• Kenjiro Nishikawa, NTT Corporation, Japan
• Juan M. O'Callaghan, Universitat Politècnica de Catalunya, Spain
• Abbas Sayed Omar, Otto-von-Guericke University, Germany
• Beatriz Ortega, Universidad Politécnica de Valencia, Spain
• Sergio Pacheco, Freescale Semiconductor, Inc., USA
• Massimiliano Pieraccini, Università degli Studi di Firenze, Italy
• Sheila Prasad, Northeastern University, USA
• Xianming Qing, Institute for Infocomm Research, Singapore
• Rüdiger Quay, Fraunhofer Institute of Applied Solid-State Physics (IAF), Germany
• Mirco Raffetto, University of Genoa, Italy
• Antonio Raffo, University of Ferrara, Italy
• Murilo A. Romero, University of Sao Paulo, Brazil
• Luca Roselli, University of Perugia, Italy
• Arye Rosen, Drexel University, USA
• Anders Rydberg, Uppsala University, Sweden
• Safieddin Safavi-Naeini, University of Waterloo, Canada
• Salvador Sales Maicas, Universidad Politécnica de Valencia, Spain
• Alberto Santarelli, University of Bologna, Italy
• Jonathan B. Scott, The University of Waikato, New Zealand
• Almudena Suarez, Universidad de Cantabria, Spain
• Riccardo Tascone, Politecnico di Torino, Italy
• Smail Tedjini, Grenoble Institute of Techology, France
• Ichihiko Toyoda, Saga University, Japan
• Samir Trabelsi, Agricultural Research Service, US Department of Agriculture, USA
• Chih Ming Tsai, National Cheng Kung University, Taiwan
• Giorgio Vannini, Universita' degli Studi di Ferrara, Italy
• Borja Vidal, Universidad Politécnica de Valencia, Spain
• Nakita Vodjdani, Agence Nationale de la Recherche, France
• Jan Vrba, Czech Technical University, Czech Republic
• Huei Wang, National Taiwan University, Taiwan
• Chien-Jen Wang, National University of Tainan, Taiwan
• Jean Pierre Wigneron, EPHYSE-INRA, France
• Yong-Zhong Xiong, Institute of Microelectronics, Singapore
• Yansheng Xu, Polytechnique Montréal, Canada
• M. C E Yagoub, University of Ottawa, Canada
• Kamya Yekeh Yazdandoost, National Institute of Information and Communications Technology, Japan
• Ning Hua Zhu, Chinese Academy of Sciences, China
• Herbert Zirath, Chalmers University, Sweden