Review Article

Polymers for Fabricating Nerve Conduits

Table 1

Summary of polymers used for fabricating nerve conduits.

MaterialChemical structure ( ) ( )Molecular weight (g/mol), intrinsic viscosity [ ], and composition [reference(s)]Fabrication method [reference(s)]Mechanical properties [reference(s)]

Alginate/Chitosan blendAlginate: 57% mannuronic acid; Chitosan: 89% and 91% Mandrel coating [31]0.38 ± 0.16 N (pull-out force) 37 ± 1, 40 ± 4, and 61 ± 1 kPa (shear modulus) under normal forces of 3, 10, and 30 N

Chitosan 138686.tab.001a203 210 k, 93% Dip-coating [25]
 22 k, 92.3% Injection molding [26]
400 k, 89% Injection molding [29]
85% Soft lithography and molding [27]
1.8 M, 85.1% Braiding and molding [28]Unreinforced porous conduits: 0.41 ± 0.17 MPa; Fiber-reinforced conduits: 3.69 ± 0.64 MPa (tensile strength)

Chitosan/PLA blend Chitosan: 22 k, 92.3% ; PLA: 460 kMandrel coating [30]

Collagen    Dip-coating and crosslinking [32, 33]
Injection molding and crosslinking [3436]
Fiber winding [37]
Unidirectional freezing and freeze-drying [3840]
Film rolling and crosslinking [41, 42]Crosslinked: 32.6 ± 0.6 or 22.5 ± 0.7 kPa; Uncrosslinked: 16.7 ± 0.7 kPa. (tensile modulus) [42]

Collagen/Chitosan blend Unidirectional freezing and freeze-drying [43]
Chitosan: 150 k, 96.7% , Collagen: Chitosan = 4 : 187 ± 7 kPa (tensile modulus)
Collagen: Chitosan = 3:1Freeze-drying and steam-extrusion [44]326 ± 11 kPa (tensile modulus)
Collagen: Chitosan = 4:3886 ± 3 kPa (tensile modulus)

Gelatin   bloom number: 300Injection molding and crosslinking [4547]Porous: 0.94 ± 0.22 MPa; Nonporous: 7.25 ± 4.1 MPa (tensile stress) [46]
Dipcoating and crosslinking [4850]

Cinnamoyl HA138686.tab.001bInjection molding and photo-crosslinking [52]
HyaffBraiding [54]

SF   Injection molding [55]Dry condition: 10.9 ± 0.3 MPa (maximum fracture strength), 27.7 ± 0.8 g (compressive strength);Wet condition: 5.5 ± 0.4 MPa (maximum fracture strength), 2.5 ± 0.5 g (compressive strength).
Electrospinning and film rolling [56]

PAN-PVC138686.tab.001c Wet-phase inversion [57, 58]

PDMS or silicone138686.tab.001dCommercially available [5963]

PE138686.tab.001eCommercially available [64, 65]

PHEMA-MMA138686.tab.001f Centrifuge casting and crosslinking [6673] 177 ± 26 kPa, 311 ± 51 kPa (tensile modulus) [71] 263 ± 13 kPa (tensile modulus) [73]

PPy138686.tab.001gElectro-plating and molding [74]

PCD138686.tab.001h[ ] = 2.09 dL/g, PCL:PDO = 95 : 5Injection molding [75]

PCL138686.tab.001i~ ~6065 k [76]Dip coating [76, 77]
Braiding [78]
80 kMelt extrusion [79]
Wire mesh and mandrel coating [80]206–345 MPa (tensile modulus) 20–34 MPa (tensile strength)

PCL/CultiSpherWire mesh and mandrel coating [80]0.13 ± 0.1 MPa (tensile modulus) 0.51 ± 0.3 MPa (tensile strength)

PCL/gelatin and PCL/PLL grafted gelatinPCL: 80k; gelatin: bloom number 300; FITC-labeled PLL: 30–70 k; PLL bromide: 150–300 kMelt extrusion and inner surface treatment [79]

PCLA138686.tab.001j ~ 39 3.5 k Injection molding and photo-crosslinking [81] 70.0 ± 31.1 MPa (tensile modulus at C)

PCLF138686.tab.001k~ 429 kInjection molding and photo-crosslinking [8284]138 ± 17 MPa (tensile modulus)
0.42 ± 0.03 N (pull-out force)
73.4 ± 12.7 MPa (flexural modulus)

PDLLA138686.tab.001l 46.7 k [85] Dip coating [65, 85, 86]

PDLLC138686.tab.001mLA:CL = 50 : 50;
L:D in LA = 85 : 15
Dip coating [87]
LA:CL = 80 : 20Ink-jet microdispensing [88]

PDO138686.tab.001n 16 110 [ ] = 1.89 dL/g Injection molding [75]

PGA138686.tab.001o45–50 [89]225–235 [89]150 kBraiding and dip-coating with collagen [9094]

PGC138686.tab.001p[ ] = 1.63 dL/g,
GA:CL = 65 : 35
Injection molding [75]

PGS138686.tab.001q5.23, 37.62 [95]Injection molding and crosslinking [95, 96]0.28 MPa (tensile modulus) > 0.5 MPa (tensile strength)

PHB138686.tab.001rFilm rolling [97, 98]
Commercially available [99]

PHBHHx138686.tab.001sDip coating and leaching [100]Conduits with non-uniform wall porosity: 2.29 ± 0.37 MPa, with uniform wall porosity: 0.94 ± 0.19 MPa (wet state tensile stress)

PHBV/P(L-D,L)LA/PLGA blend138686.tab.001tPHBV: 95% PHB; P(L-D,L)LA:PLLA:P(D,L)LA = 70 : 30, [ ] = 5.5–6.5 g/dL; PLGA: 50 : 50 , [ ] = 0.32–0.44 g/dL Solvent casting from micropatterned silicon templates and then film rolling on electrospun mat [101] Solid film: 1.05 ± 0.23 MPa, Porous film: 0.08 ± 0.02 MPa (tensile modulus)
138686.tab.001u
138686.tab.001v

PLC138686.tab.001w 60 134 [ ] = 1.58 dL/g, LA:CL = 60 : 40 Injection molding [75]

PLGA138686.tab.001x 113 k, 75 : 25 , 52 k, 50 : 50 , Pluronic F127 (EG99PG65EG99, 12.5 k) added.Immersion precipitation [102, 103]
[ ] = 0.5–0.79 dL/g, 50 : 50 ; [ ] = 1.2–1.59 dL/g, 90 : 10+ [104]51.9 k, [ ] = 0.9–1.2 dL/g, 85 : 15 [105]Dipcoating and immersion precipitation [104, 105]
[ ] = 0.2 dL/g, 50 : 50 Wet phase inversion [106]
94 k, 85 : 15 [107] 122 k, 75 : 25 [108] 58.8 k, 50 : 50 ; 92 k, 75 : 25 ; 120 k, 85 : 15+ [109] 75 k, 85 : 15 [110] 80–120 k, 11–24 k, 75 : 25 [111]136 k, 85 : 15 [112, 113]Injection molding [107113]7-channel, porosity of 78.6% : 0.8 ± 0.2 kPa; 7-channel, porosity of 78.6%: 510 ± 130 kPa (compression modulus) [108]Porous multiple lumen conduits using 80–120 K (porogen:polymer = 12 : 1): 134 kPa (compression modulus) [111]
37.4 k, 75 : 25 Extrusion [114]Porous conduits: ~8 MPa (tensile modulus)
100 k, 10 : 90 Electrospinning [115]
10 : 90 Microbraiding [116]
64.7 k, 85 : 15+Dip coating [117]

PLGA/gelatin blendMolding [118]Composition dependent: ~0.25–~3.75 MPa (tensile strength)

PLGC138686.tab.001y 300 k, LA:GA:CL = 75 : 8:1 Film rolling [119]

PLLA138686.tab.001z55–60170–17546.5 kExtrusion [114]Porous conduits: ~80 MPa (tensile modulus)
Braiding [120]
46.5 k [121]Solvent casting, extrusion, and particulate leaching [121, 122]81.7 ± 35.1 MPa (tensile strength), 1.0 ± 0.4 MPa (tensile modulus) [121]
Fused deposition [89]
100 k [117]Dip coating [117, 123]

PLLA and PGA130 k [94]Braiding and dip coating with collagen [94]

PLLA-PEG-MA138686.tab.001aaLLA:PEG = 2 : 1 and 4 : 1Centrifuge casting and crosslinking [124]

PPE, or P(BHET-EOP/TC)138686.tab.001bb14.9 k and 18.9 k, EOP/TC = 80 : 20,  :  = 4 : 1Dip coating [125127]

PPF-PCL138686.tab.001cc 17.129k, PPF:PCL = 10 : 90Injection molding and photo-crosslinking [128]2.68 ± 0.05 MPa (tensile modulus); single-channel conduits: 52.0 ± 1.2 MPa (flexural modulus); seven-channel conduits: 66.0 ± 3.7 MPa (flexural modulus); 0.11 N (pull-out force)

PSU138686.tab.001dd185Commercially available [129131]

PTMC-CL138686.tab.001ee47TMC:CL = 30 : 70,
[ ] = 1.31 dL/g
Dip coating [132, 133]
44TMC:CL = 15 : 85,
[ ] = 1.27 dL/g

PU based on PEG and PCL diol138686.tab.001ff110 kDip coating [134]
Rapid prototyping [135]~8–~15 MPa (tensile strength)

PU based on PHBV-diol and PGC-diol138686.tab.001gg 120178 k1.9 MPa (tensile modulus)
122105 kExtrusion [136]8.4 MPa (tensile modulus)
123160 k46 MPa (tensile modulus)

Deacetylation degree; Lactide:Glycolide (LA:GA) ratio.