Bisphenyl-Polymer/Carbon-Fiber-Reinforced Composite Compared to Titanium Alloy Bone Implant

Table 2

Resistivity^a of different engineering and biological materials (Ωm).

Material	Type	Resistivity
Titanium pure	Conductor	4.2–5.2 × 10^−7 [18]
Titanium-6Al-4V alloy	Conductor	1.7 × 10^−8[18]
Bisphenol-polymer/carbon Fiber Composite	Semiconductor	5 [19]
Bone longitudinal	Semiconductor	46 [9]
Bone radial	Semiconductor	150 [9]
Physiologic saline	Semiconductor	0.72 [9]
Silicon pure	Semiconductor	3000 [26]
Silicon phosphorous Doped	Semiconductor	20–80 [27]
Lipid phosphate headgroup/water interface	Semiconductor	100 [28]
Carbon fibers	Conductor	0.95–1.8 × 10^−5 [18]
Thermoset bisphenyl polymer	Insulator	10^10–10^13 [18]
General metals	Conductors	~10^−6–10^−9 [18]
Pure quartz fiber	Insulator	10^20[29]

^aResistivity = 1/conductivity.