Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-<i>co</i>-glycolic acid) Microstructures

<div>The copper mold with square patterns.</div>

International Journal of Polymer Science

Figure 6: Simulation and Experimental Validation of the Hot Embossing Process of Poly(lactic-<i>co</i>-glycolic acid) Microstructures 