Amphiphilic Copolymers for Nanomaterials

Call for Papers

Amphiphilic copolymers have been widely investigated, because their properties are easily controlled by tuning the balance of hydrophilic and hydrophobic monomers. Unlike the polymer blend, the amphiphilic copolymers can provide fine structures at the nanometer level, such as nanospheres and micelles. The controlled nanomaterials composed of amphiphilic copolymers have been applied in various areas.

We invite authors to submit original research and review articles on the recent developments in synthesis and physical properties of amphiphilic copolymers, including hybrid with inorganic materials, as well as block copolymers, graft copolymers, and random copolymers. We are also interested in the medical application of nanoparticles and micelles using amphiphilic copolymers. Potential topics include, but are not limited to:

• Amphiphilic copolymers for micellization and nanoparticles
• Application of amphiphilic copolymers to medical area
• Application of amphiphilic copolymers to surfactant and oil industry, as well as optical, electronic, magnetic, and thermal properties
• Synthesis of amphiphilic polymers, such as block and graft copolymers
• Nanostructure control and physical properties of amphiphilic copolymers, such as nanospheres and nanofibers

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/ijps/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijps/amph/ according to the following timetable:

Lead Guest Editor

• Baki Hazer, Department of Chemistry, Zonguldak Karaelmas University, 67100 Zonguldak, Turkey

Guest Editors

• Young Baek Kim, Department of Nano-Polymeric Systems, College of Engineering, Pai Chai University, Daejeon 302-735, Republic of Korea
• Hiroharu Ajiro, Department of Applied Chemistry, Center for Advanced Medical Engineering and Informatics, Osaka University, Suita, Osaka 565-0871, Japan