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Application of Nanofillers in Polymer Composites

Call for Papers

Advancement in nanotechnology has attracted much attention for their potential applications in advanced high-strength polymer composite materials. Both academic and industrial interests are now drawn towards investigating the further potentials of nanosized fillers in replacing micron fillers. Nanofiller types can be loaded to polymer at lower percentages (1–4 vol%) if compared to micron-sized fillers which normally have been loaded up to 60 vol%. The addition of low filler loadings can reduce the product cost with unique combination of properties. This combination of properties can be achieved because of the small size of the fillers, the large surface area of the fillers provide, and in many cases the unique properties of the filler itself. However, agglomeration of nanofiller is a common issue as a result of large surface area and van der Waals forces. The addition of high loading of agglomerated nanofiller causes the polymer nanocomposite to fail in brittle mode. Chemical treatment method has commonly been used to modify the nanofiller surface. By using this treatment method, filler-filler interaction will be reduced, and homogeneity of the nanofiller will be achieved.

We invite investigators to contribute original research articles as well as review articles that will stimulate the continuing efforts to understand the influence of nanofillers on the properties of polymer composites. Potential topics include, but not limited to:

  • Recent development on nanofiller/polymer composites
  • Role of nanofiller/polymer interphase
  • Application of carbon nanofillers in polymer composites
  • Development of nanocellulose
  • Development of nanofillers for antimicrobial in polymer applications
  • Identification of conductive nanofillers filled polymer composites

Before submission authors should carefully read over the journal's Author Guidelines, which are located at http://www.hindawi.com/journals/ijps/guidelines/. Prospective authors should submit an electronic copy of their complete manuscript through the journal Manuscript Tracking System at http://mts.hindawi.com/submit/journals/ijps/fill/ according to the following timetable:

Manuscript DueFriday, 29 March 2013
First Round of ReviewsFriday, 21 June 2013
Publication DateFriday, 16 August 2013

Lead Guest Editor

  • M. Mariatti Jaafar, School of Materials and Mineral Resources Engineering, Universiti Sains Malaysia, USM Engineering Campus, 14300 Nibong Tebal, Malaysia

Guest Editors

  • Hao Wang, Centre of Excellence in Engineered Fiber Composites, University of Southern Queensland, Toowoomba, QLD 4350, Australia
  • Lei Pan, College of Materials Science and Technology, Nanjing University of Aeronautics and Astronautics, 29 Yudao Street, Nanjing, China